
Viking Technology has developed RAM-Stack™, an innovative DRAM packaging solution. RAM-Stack enables Viking to support the high density DDR2 & DDR3 DRAM modules, space constrained systems and thermally challenging environments. This innovative stacking technology was specifically engineered to meet the extreme demands of the Enterprise Server & Storage, Embedded, Networking & Communications markets.
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Power, Thermal & Reliability Benefits
The RAM-Stack™ design has superior thermal characteristics when compared to other stacking technologies available in the market today. The key lies in the ability for RAM-Stack™ to get the heat out of the DRAM die more efficiently than other competitive solutions. Therefore, at the same power level as modules built with other stacking technologies, the RAM-Stack™ DRAM junction temperatures run lower (a lower junction to case & junction to board thermal resistance). This means that RAM-Stack™ built modules exhibit a higher long-term reliability & less tendency for retention related ECC errors.
Volumetric Density
Any RAM-Stack™ module of equal capacity & configuration to a BGA stacked module has a superior volumetric density (i.e thinner). Having a superior volumetric density allows system designers to utilize their cooling & power restrictions more efficiently. For example, system boards populated with thinner RAM-Stack™ modules will have wider gaps between each module, thus by having lower air resistance the result is a superior cooling environment. To turn this into cost savings, system designers have the option of using lower fan speeds or lower power fans (power saving) to keep the system at the required temperature.
Electricity Costs of Power & Cooling
The cost of electricity to cool server farms accounts for about 50% of the power bill.
(J.Koomey. Professor at Stanford University)