INNOVATION

Packaging Design

The design of memory subsystems has become more complex as the need for higher speeds & DRAM densities continue to increase with an on-going requirement for smaller memory module form factors. Small memory module form factors such as SODIMMs, MiniDIMMs, and VLP DIMMs generally use specialized DRAM packaging technologies to achieve high density solutions. Viking Technology has created several approaches to high density packaging using in-house developed BGA stacking (BGA-Stack), RAM-Stacking (RAM-Stack™) and NAND stacking technologies (SATA Cube3™).

Some of the features and benefits of our stacking technologies are:

  • Lower cost modules compared to those assembled using costly DDP’s or high density single die monolithic devices
  • Short lead times and minimum order quantities.
  • Reliable and consistent quality. Stacking in performed in-house under Viking & Sanmina-SCI quality control
  • Stacking offers flexibility in the component supply chain, with multiple chip vendor choices
  • Stacked modules are available in the Industrial Temperature range: -40 to +85ºC
  • Stacks for DRAM memory modules will fit into standard socket spacing specified by JEDEC
  • Robust design attributes on stacks provide guardband margin for environmental operating conditions and timing variations on different motherboards/servers
  • Electrical, thermal and reliability characteristics comparable to DDP and QDP solutions